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Storia in 19 fonti

Huawei proposes new path for chips as Moore’s Law runs out of road

Huawei has proposed a new guiding principle for the semiconductor industry that could allow it to close gap with TSMC.

Raccontata dacaixinglobal.comglobal.chinadaily.com.cnscmp.comg1.globo.comeconomictimes.indiatimes.comthenextweb.comnewsbytesapp.comrfi.frcnbc.comthehindu.comhurriyetdailynews.commalaymail.com+7 altre

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6 prospettive sulla stessa storia
AI · summaries
siliconrepublic.comStai leggendo12 h fa

Huawei proposes new path for chips as Moore’s Law runs out of road

Huawei has proposed a new guiding principle for the semiconductor industry that could allow it to close gap with TSMC.

originale
fortune.com8 h fa

Huawei touts chip breakthrough to shorten gap with TSMC | Fortune

Huawei unveiled LogicFolding and Her's Law, targeting 1.4nm chips with SMIC by 2031 without ASML EUV—three years behind TSMC. If validated, it breaks the EUV-mandatory consensus for sub-5nm, threatening Western export controls on China's AI stack.

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newsbytesapp.com14 h fa

Huawei reveals roadmap for 1.4nm chips by 2031

Huawei aims to develop 1.4nm chips by 2031, leveraging innovative methods to close the technological gap with TSMC despite lacking access to cutting-edge manufacturing equipment.

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tomshardware.com7 h fa

Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor…

Flagship Huawei Mate 90 series will be the first commercial processors to feature the LogicFolding architecture

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thehindubusinessline.com12 h fa

Huawei unveils new approach to strengthen dominance in high-end chips

Huawei claims the new advanced chips that it has planned to make are based on the Tau Scaling Law that could achieve transistor density levels equivalent to 1.4 nm.

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global.chinadaily.com.cn21 h fa

Huawei unveils 1.4nm-equivalent chip target despite US sanctions

Huawei Technologies Co expects its premium chips to achieve transistor density equivalent to 1.4-nanometer processes by 2031 under a new semiconductor development framework, the company announced on Monday at a…

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Timeline cronologica

  1. lunedì 25 maggio 2026·caixinglobal.com

    Huawei Targets 1.4-Nanometer Chip Performance by 2031 With New Design Architecture

    The Chinese tech giant said its “Tau Scaling Law” can boost chip efficiency through vertically stacked circuit design

  2. lunedì 25 maggio 2026·global.chinadaily.com.cn

    Huawei unveils 1.4nm-equivalent chip target despite US sanctions

    Huawei Technologies Co expects its premium chips to achieve transistor density equivalent to 1.4-nanometer processes by 2031 under a new semiconductor development framework, the…

  3. lunedì 25 maggio 2026·scmp.com

    Huawei unveils new scaling law and tech that can develop 1.4 nm equivalent chips

    The Chinese tech giant’s new breakthrough is a major milestone in its mission to create a self-reliant semiconductor ecosystem.

  4. lunedì 25 maggio 2026·g1.globo.com

    Huawei propõe caminho para desenvolver chips em meio a sanções dos EUA | G1

    Empresa espera projetar chips de ponta até 2031 com densidade de transistores equivalente a processos de 1,4 nanômetro, o que significa uma tecnologia avançada em relação ao que se

  5. lunedì 25 maggio 2026·economictimes.indiatimes.com

    Huawei proposes new path for chip development amid US sanctions - The Economic Times

    Huawei aims for advanced chip design by 2031. The company is developing a new 'Tau Scaling Law' to improve chip performance. This innovation could bypass US sanctions restricting…

  6. lunedì 25 maggio 2026·thenextweb.com

    Huawei unveils ‘Tau Scaling Law’ as China’s workaround for US chip sanctions

    Huawei's He Tingbo used an ISCAS keynote in Shanghai to pitch the Tau Scaling Law, a chip-design approach built around signal time rather than transistor size.

  7. lunedì 25 maggio 2026·newsbytesapp.com

    Huawei targets 1.4nm chips by 2031 to rival TSMC

    Huawei aims to develop 1.4nm chips by 2031, leveraging innovative methods to close the gap with TSMC despite lacking access to cutting-edge semiconductor manufacturing equipment.

  8. lunedì 25 maggio 2026·rfi.fr

    Huawei touts new chipmaking technology to sidestep US restrictions

    Chinese tech giant Huawei said on Monday it had developed a new way of making semiconductors that could get around its US-enforced lack of access to the most advanced chipmaking…

  9. lunedì 25 maggio 2026·cnbc.com

    Huawei unveils new smartphone chips this fall as rivalry with Nvidia and Apple heats up

    Chinese telecom giant Huawei announced Monday a new way of designing chips that improves their capabilities, despite U.S. restrictions on the company.

  10. lunedì 25 maggio 2026·newsbytesapp.com

    Huawei reveals roadmap for 1.4nm chips by 2031

    Huawei aims to develop 1.4nm chips by 2031, leveraging innovative methods to close the technological gap with TSMC despite lacking access to cutting-edge manufacturing equipment.

  11. lunedì 25 maggio 2026·thehindu.com

    Huawei touts new chipmaking technology to sidestep U.S. restrictions

    Huawei said it had developed a new way of making semiconductors that could get around its U.S.-enforced lack of access

  12. lunedì 25 maggio 2026·hurriyetdailynews.com

    Huawei touts new chipmaking technology to sidestep US restrictions - Latest News

    Chinese tech giant Huawei said on May 25 it had developed a new way of making semiconductors that could get around its U.S.-enforced lack of access to the most advanced chipmaking…

  13. lunedì 25 maggio 2026·malaymail.com

    Huawei unveils chip design breakthrough, targets 1.4‑nm‑equivalent density by 2031 despite US curbs

    Huawei unveils chip design strategy to boost performanceStrategy focuses on scaling, rather than making transistors smallerHuawei expects to design chips by 2031 with density...

  14. lunedì 25 maggio 2026·rappler.com

    China's Huawei reveals chip design breakthrough amid US sanctions

    Huawei did not provide independent performance data, but the target is significant because 1.4 nanometers is expected to be close to the global frontier for advanced chipmaking…

  15. lunedì 25 maggio 2026·dailysabah.com

    Huawei unveils chip design breakthrough amid US sanctions

    Huawei Technologies announced on Monday that it expects to produce industry-leading semiconductors within five years using new technology, highlighting...

  16. lunedì 25 maggio 2026·dday.it

    Huawei sfida TSMC e Intel: chip “equivalenti” a 1,4 nm senza litografia avanzata

    Non avendo accesso alla litografia avanzata, Huawei si getta nello spazio 3D logico. Con Tau Scaling Law e LogicFolding, promette più densità e meno ritardi nei segnali. Il primo…

  17. lunedì 25 maggio 2026·siliconrepublic.com

    Huawei proposes new path for chips as Moore’s Law runs out of road

    Huawei has proposed a new guiding principle for the semiconductor industry that could allow it to close gap with TSMC.

  18. lunedì 25 maggio 2026·thehindubusinessline.com

    Huawei unveils new approach to strengthen dominance in high-end chips

    Huawei claims the new advanced chips that it has planned to make are based on the Tau Scaling Law that could achieve transistor density levels equivalent to 1.4 nm.

  19. lunedì 25 maggio 2026·hindustantimes.com

    Huawei Says It Has Workaround to Match Leading Chips

    The Chinese tech juggernaut says it can match cutting-edge Intel semiconductors by 2031. | Business News

  20. lunedì 25 maggio 2026·valor.globo.com

    Huawei propõe novo caminho para o desenvolvimento de chips em meio a sanções dos EUA

    Meta é significativa porque espera-se que processos 1,4 nanômetros esteja próximo da fronteira global para a fabricação avançada de chips por volta do final da década