Bloomberg
Huawei Technologies Co (華為) said it has come up with a new pathway to shorten its gap with industry leader Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), potentially achieving a breakthrough in making advanced semiconductors without cutting-edge equipment. Right now there is about a five-year gap between what TSMC is capable of and what Huawei, together with its manufacturing partner Semiconductor Manufacturing International Corp (中芯), can produce. Huawei is to start making 1.4-nanometer chips by 2031 with its own “LogicFolding” technology, Huawei semiconductor chief He Tingbo (何庭波) said in a rare public appearance during a chip conference yesterday, while TSMC has said that it would begin mass production of the same product in 2028.
Huawei Technologies Co’s logo is pictured at the Porte de Versailles exhibition center in Paris on June 12 last year.
He added that the Kirin mobile chips, set to be launched this fall, would be the first to adopt the LogicFolding architecture, which helps boost the chip performance by increasing the number of transistors it carries and optimizing data transmission speed. “This year we have prepared a surprise for the whole industry. Not saturation, not continuation, but a big leap ahead,” she said.
