Huawei will use its proprietary "LogicFolding" tech to produce these chips
May 25, 2026
10:54 am
What's the storyHuawei Technologies has announced a new strategy to close the gap with Taiwan Semiconductor Manufacturing Company (TSMC), the industry leader in semiconductor production.
The company plans to start manufacturing 1.4-nanometer (nm) chips by 2031 using its proprietary "LogicFolding" technology, despite a current five-year gap between what TSMC can do and what Huawei, together with Semiconductor Manufacturing International Corp (SMIC), can produce.
