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Huawei proposes new path for chip development amid US sanctions - The Economic Times
Huawei aims for advanced chip design by 2031. The company is developing a new 'Tau Scaling Law' to improve chip performance. This innovation could bypass US sanctions restricting access to cutting-edge semiconductor technology. Huawei's upcoming Kirin chips will feature a related 'LogicFolding' architecture. The company has already produced hundreds of chips based on this new principle.
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global.chinadaily.com.cn
Huawei unveils 1.4nm-equivalent chip target despite US sanctions
Huawei Technologies Co expects its premium chips to achieve transistor density equivalent to 1.4-nanometer processes by 2031 under a new semiconductor development framework, the…
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caixinglobal.com
Huawei Targets 1.4-Nanometer Chip Performance by 2031 With New Design Architecture
The Chinese tech giant said its “Tau Scaling Law” can boost chip efficiency through vertically stacked circuit design
