Huawei touts new chipmaking technology to sidestep US restrictions
Chinese tech giant Huawei said on May 25 it had developed a new way of making semiconductors that could get around its U.S.-enforced lack of access to the most advanced chipmaking equipment.
Sanctions since 2019 have cut Huawei's access to components and technologies made by the United States and some of its allies, including the lithography machines used to make the world's most advanced chips.
But yesterday the head of Huawei's semiconductor division He Tingbo said that the company will be able to produce next-generation 1.4-nanometer (1.4nm) chips by 2031.
Taiwan's TSMC, the industry leader, has projected it will be able to do the same by 2028.
