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SHANGHAI: Chinese tech giant Huawei said on Monday it had developed a new way of making semiconductors that could get around its US-enforced lack of access to the most advanced chipmaking equipment.
Huawei has been at the centre of a geopolitical standoff in recent years after Washington warned its equipment could be used by the Chinese government for espionage, an allegation the firm denies.
Sanctions since 2019 have cut Huawei’s access to components and technologies made by the US and some of its allies -- including the lithography machines used to make the world’s most advanced chips.
However, the head of Huawei’s semiconductor division He Tingbo said on Monday that the company will be able to produce chips equivalent to next-generation 1.4-nanometre (1.4nm) ones by 2031.
