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Storia in 19 fonti

Huawei punta all'indipendenza tecnologica nella produzione dei chip entro il 2031 - Future Tech - Ansa.it

L'obiettivo del colosso è concorrere con Tsmc e Samsung, colmando un ritardo di tre anni (ANSA)

Raccontata da

global.chinadaily.com.cn

caixinglobal.com

newsbytesapp.com

siliconrepublic.com

thehindubusinessline.com+7 altre

Confronto fonti

6 prospettive sulla stessa storia

AI · summaries

ansa.itStai leggendo1 g fa

Huawei punta all'indipendenza tecnologica nella produzione dei chip entro il 2031 - Future Tech - Ansa.it

L'obiettivo del colosso è concorrere con Tsmc e Samsung, colmando un ritardo di tre anni (ANSA)

Timeline cronologica

lunedì 25 maggio 2026·global.chinadaily.com.cn
Huawei unveils 1.4nm-equivalent chip target despite US sanctions
Huawei Technologies Co expects its premium chips to achieve transistor density equivalent to 1.4-nanometer processes by 2031 under a new semiconductor development framework, the…
lunedì 25 maggio 2026·caixinglobal.com
Huawei Targets 1.4-Nanometer Chip Performance by 2031 With New Design Architecture
The Chinese tech giant said its “Tau Scaling Law” can boost chip efficiency through vertically stacked circuit design

1 g fa

Huawei vicina alla frontiera chip AI: l'annuncio è una sveglia per l'Occidente - AI4Business

Huawei sostiene di poter arrivare entro il 2031 a semiconduttori con densità equivalente a 1,4 nanometri, puntando su packaging avanzato, architetture 3D e chip AI per ridurre il gap con TSMC e Nvidia nonostante le…

Leggi questa versione → originale

manager-magazin.de2 g fa

Trotz US-Sanktionen: Chinas Huawei kündigt Durchbruch bei Chipentwicklung an

Die USA tun alles, um Chinas Techindustrie auf Abstand zu halten, doch Huawei gibt sich optimistisch: Auf einer Konferenz in Shanghai kündigte das Unternehmen einen Durchbruch in der Halbleiterproduktion an.

Leggi questa versione → originale

Huawei sfida TSMC e Intel: chip “equivalenti” a 1,4 nm senza litografia avanzata

Non avendo accesso alla litografia avanzata, Huawei si getta nello spazio 3D logico. Con Tau Scaling Law e LogicFolding, promette più densità e meno ritardi nei segnali. Il primo banco di prova sarà il Kirin atteso in…

Leggi questa versione → originale

newsbytesapp.com2 g fa

Huawei reveals roadmap for 1.4nm chips by 2031

Huawei aims to develop 1.4nm chips by 2031, leveraging innovative methods to close the technological gap with TSMC despite lacking access to cutting-edge manufacturing equipment.

Leggi questa versione → originale

fortune.com2 g fa

Huawei touts chip breakthrough to shorten gap with TSMC | Fortune

Huawei unveiled LogicFolding and Her's Law, targeting 1.4nm chips with SMIC by 2031 without ASML EUV—three years behind TSMC. If validated, it breaks the EUV-mandatory consensus for sub-5nm, threatening Western export controls on China's AI stack.

Leggi questa versione → originale

lunedì 25 maggio 2026·

scmp.com

Huawei unveils new scaling law and tech that can develop 1.4 nm equivalent chips

The Chinese tech giant’s new breakthrough is a major milestone in its mission to create a self-reliant semiconductor ecosystem.

lunedì 25 maggio 2026·

g1.globo.com

Huawei propõe caminho para desenvolver chips em meio a sanções dos EUA | G1

Empresa espera projetar chips de ponta até 2031 com densidade de transistores equivalente a processos de 1,4 nanômetro, o que significa uma tecnologia avançada em relação ao que se

lunedì 25 maggio 2026·

newsbytesapp.com

Huawei targets 1.4nm chips by 2031 to rival TSMC

Huawei aims to develop 1.4nm chips by 2031, leveraging innovative methods to close the gap with TSMC despite lacking access to cutting-edge semiconductor manufacturing equipment.

lunedì 25 maggio 2026·

newsbytesapp.com

Huawei reveals roadmap for 1.4nm chips by 2031

Huawei aims to develop 1.4nm chips by 2031, leveraging innovative methods to close the technological gap with TSMC despite lacking access to cutting-edge manufacturing equipment.

lunedì 25 maggio 2026·

thehindu.com

Huawei touts new chipmaking technology to sidestep U.S. restrictions

Huawei said it had developed a new way of making semiconductors that could get around its U.S.-enforced lack of access

lunedì 25 maggio 2026·

malaymail.com

Huawei unveils chip design breakthrough, targets 1.4‑nm‑equivalent density by 2031 despite US curbs

Huawei unveils chip design strategy to boost performanceStrategy focuses on scaling, rather than making transistors smallerHuawei expects to design chips by 2031 with density...

lunedì 25 maggio 2026·

rappler.com

China's Huawei reveals chip design breakthrough amid US sanctions

Huawei did not provide independent performance data, but the target is significant because 1.4 nanometers is expected to be close to the global frontier for advanced chipmaking…

lunedì 25 maggio 2026·

dailysabah.com

Huawei unveils chip design breakthrough amid US sanctions

Huawei Technologies announced on Monday that it expects to produce industry-leading semiconductors within five years using new technology, highlighting...

lunedì 25 maggio 2026·

dday.it

Huawei sfida TSMC e Intel: chip “equivalenti” a 1,4 nm senza litografia avanzata

Non avendo accesso alla litografia avanzata, Huawei si getta nello spazio 3D logico. Con Tau Scaling Law e LogicFolding, promette più densità e meno ritardi nei segnali. Il primo…

lunedì 25 maggio 2026·

siliconrepublic.com

Huawei proposes new path for chips as Moore’s Law runs out of road

Huawei has proposed a new guiding principle for the semiconductor industry that could allow it to close gap with TSMC.

lunedì 25 maggio 2026·

thehindubusinessline.com

Huawei unveils new approach to strengthen dominance in high-end chips

Huawei claims the new advanced chips that it has planned to make are based on the Tau Scaling Law that could achieve transistor density levels equivalent to 1.4 nm.

lunedì 25 maggio 2026·

hindustantimes.com

Huawei Says It Has Workaround to Match Leading Chips

The Chinese tech juggernaut says it can match cutting-edge Intel semiconductors by 2031. | Business News

lunedì 25 maggio 2026·

valor.globo.com

Huawei propõe novo caminho para o desenvolvimento de chips em meio a sanções dos EUA

Meta é significativa porque espera-se que processos 1,4 nanômetros esteja próximo da fronteira global para a fabricação avançada de chips por volta do final da década

lunedì 25 maggio 2026·

manager-magazin.de

Trotz US-Sanktionen: Chinas Huawei kündigt Durchbruch bei Chipentwicklung an

Die USA tun alles, um Chinas Techindustrie auf Abstand zu halten, doch Huawei gibt sich optimistisch: Auf einer Konferenz in Shanghai kündigte das Unternehmen einen Durchbruch in…

lunedì 25 maggio 2026·

fortune.com

Huawei touts chip breakthrough to shorten gap with TSMC | Fortune

Huawei will start making 1.4-nanometer chips by 2031 with its own “LogicFolding” technology, Huawei’s semiconductor chief He Tingbo said Monday.

lunedì 25 maggio 2026·

techspot.com

Huawei now says it can build 1.4nm-class chips without ASML's most advanced machines

The approach, still in development, aims to produce processors that reach transistor densities comparable to a 1.4-nanometer process by 2031. That level of density is widely…

lunedì 25 maggio 2026·

tomshardware.com

Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new…

Flagship Huawei Mate 90 series will be the first commercial processors to feature the LogicFolding architecture

lunedì 25 maggio 2026·

businessday.co.za

China’s Huawei makes progress towards advanced chip production

Company is upbeat on being competitive in 10 years for mobile and AI computing