"In her speech, she presented the Tau (τ) Scaling Law, a new principle for guiding the future development of the semiconductor industry."

Huawei Technologies Co expects its premium chips to achieve transistor density equivalent to 1.4-nanometer processes by 2031 under a new semiconductor development framework, the…

The Chinese tech giant said its “Tau Scaling Law” can boost chip efficiency through vertically stacked circuit design

The Chinese tech giant’s new breakthrough is a major milestone in its mission to create a self-reliant semiconductor ecosystem.

Huawei aims for advanced chip design by 2031. The company is developing a new 'Tau Scaling Law' to improve chip performance. This innovation could bypass US sanctions restricting…

Huawei's He Tingbo used an ISCAS keynote in Shanghai to pitch the Tau Scaling Law, a chip-design approach built around signal time rather than transistor size.

Huawei aims to develop 1.4nm chips by 2031, leveraging innovative methods to close the gap with TSMC despite lacking access to cutting-edge semiconductor manufacturing equipment.

Chinese tech giant Huawei said on Monday it had developed a new way of making semiconductors that could get around its US-enforced lack of access to the most advanced chipmaking…

Chinese telecom giant Huawei announced Monday a new way of designing chips that improves their capabilities, despite U.S. restrictions on the company.

He Tingbo, Huawei's "chip queen", spearheads the company's semiconductor innovation. Facing U.S. sanctions, Huawei is developing new chip technologies. He Tingbo introduced the…

Huawei said it had developed a new way of making semiconductors that could get around its U.S.-enforced lack of access

Chinese tech giant Huawei said on May 25 it had developed a new way of making semiconductors that could get around its U.S.-enforced lack of access to the most advanced chipmaking…

Huawei did not provide independent performance data, but the target is significant because 1.4 nanometers is expected to be close to the global frontier for advanced chipmaking…

Huawei Technologies announced on Monday that it expects to produce industry-leading semiconductors within five years using new technology, highlighting...

Non avendo accesso alla litografia avanzata, Huawei si getta nello spazio 3D logico. Con Tau Scaling Law e LogicFolding, promette più densità e meno ritardi nei segnali. Il primo…

Huawei has proposed a new guiding principle for the semiconductor industry that could allow it to close gap with TSMC.

Huawei claims the new advanced chips that it has planned to make are based on the Tau Scaling Law that could achieve transistor density levels equivalent to 1.4 nm.

The Chinese tech juggernaut says it can match cutting-edge Intel semiconductors by 2031. | Business News

Huawei will start making 1.4-nanometer chips by 2031 with its own “LogicFolding” technology, Huawei’s semiconductor chief He Tingbo said Monday.

Flagship Huawei Mate 90 series will be the first commercial processors to feature the LogicFolding architecture

Company is upbeat on being competitive in 10 years for mobile and AI computing