Huawei said it had developed a new way of making semiconductors that could get around its U.S.-enforced lack of access

Huawei aims for advanced chip design by 2031. The company is developing a new 'Tau Scaling Law' to improve chip performance. This innovation could bypass US sanctions restricting…

Huawei aims to develop 1.4nm chips by 2031, leveraging innovative methods to close the gap with TSMC despite lacking access to cutting-edge semiconductor manufacturing equipment.

The Chinese tech juggernaut says it can match cutting-edge Intel semiconductors by 2031. | Business News