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Huawei unveils new smartphone chips this fall as rivalry with Nvidia and Apple heats up

Chinese telecom giant Huawei announced Monday a new way of designing chips that improves their capabilities, despite U.S. restrictions on the company.

Raccontata dacaixinglobal.comglobal.chinadaily.com.cneconomictimes.indiatimes.comtechnode.comrfi.frcnbc.comthehindu.comhurriyetdailynews.comrappler.comdailysabah.comthehindubusinessline.comhindustantimes.com+7 altre

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6 prospettive sulla stessa storia
AI · summaries
cnbc.comStai leggendo1 mesi fa

Huawei unveils new smartphone chips this fall as rivalry with Nvidia and Apple heats up

Chinese telecom giant Huawei announced Monday a new way of designing chips that improves their capabilities, despite U.S. restrictions on the company.

originale
wired.com1 mesi fa

Huawei's ‘Chip Queen’ Throws Down the Gauntlet

The Chinese company is adapting to the demise of Moore’s Law, which guides chip production. It could complicate US chip dominance.

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dailysabah.com1 mesi fa

Huawei unveils chip design breakthrough amid US sanctions

Huawei Technologies announced on Monday that it expects to produce industry-leading semiconductors within five years using new technology, highlighting...

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scmp.com1 mesi fa

Huawei breakthrough chips away at Nvidia’s hold on China’s market, analysts say

Chip advance marks big step accelerating China’s semiconductor self-reliance push and promises leaps in AI computing power.

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siliconangle.com1 mesi fa

China's Huawei unveils new sanctions-busting chip architecture that replaces Moore's Law - SiliconANGLE

Huawei unveiled LogicFolding, a stacked dual-layer chip architecture based on its proprietary Tau Scaling Law, targeting 55% transistor density gains and 1.4nm-class performance by 2031 — without EUV lithography machines blocked by U.S. sanctions. If the roadmap holds, it gives China a credible domestic alternative to TSMC/Nvidia for AI datacenter silicon, reshaping the assumption that export controls alone can contain Chinese semiconductor advancement.

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economictimes.indiatimes.com1 mesi fa

Huawei proposes new path for chip development amid US sanctions - The Economic Times

Huawei aims for advanced chip design by 2031. The company is developing a new 'Tau Scaling Law' to improve chip performance. This innovation could bypass US sanctions restricting access to cutting-edge semiconductor…

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Timeline cronologica

  1. lunedì 25 maggio 2026·caixinglobal.com

    Huawei Targets 1.4-Nanometer Chip Performance by 2031 With New Design Architecture

    The Chinese tech giant said its “Tau Scaling Law” can boost chip efficiency through vertically stacked circuit design

  2. lunedì 25 maggio 2026·global.chinadaily.com.cn

    Huawei unveils 1.4nm-equivalent chip target despite US sanctions

    Huawei Technologies Co expects its premium chips to achieve transistor density equivalent to 1.4-nanometer processes by 2031 under a new semiconductor development framework, the…

  3. lunedì 25 maggio 2026·economictimes.indiatimes.com

    Huawei proposes new path for chip development amid US sanctions - The Economic Times

    Huawei aims for advanced chip design by 2031. The company is developing a new 'Tau Scaling Law' to improve chip performance. This innovation could bypass US sanctions restricting…

  4. lunedì 25 maggio 2026·technode.com

    Huawei’s mate 90 series expected to debut new Kirin chip this autumn · TechNode

    At the 2026 International Symposium on Circuits and Systems (ISCAS 2026) in Shanghai on Monday, He Tingbo, Huawei’s board member and head of its

  5. lunedì 25 maggio 2026·rfi.fr

    Huawei touts new chipmaking technology to sidestep US restrictions

    Chinese tech giant Huawei said on Monday it had developed a new way of making semiconductors that could get around its US-enforced lack of access to the most advanced chipmaking…

  6. lunedì 25 maggio 2026·cnbc.com

    Huawei unveils new smartphone chips this fall as rivalry with Nvidia and Apple heats up

    Chinese telecom giant Huawei announced Monday a new way of designing chips that improves their capabilities, despite U.S. restrictions on the company.

  7. lunedì 25 maggio 2026·thehindu.com

    Huawei touts new chipmaking technology to sidestep U.S. restrictions

    Huawei said it had developed a new way of making semiconductors that could get around its U.S.-enforced lack of access

  8. lunedì 25 maggio 2026·hurriyetdailynews.com

    Huawei touts new chipmaking technology to sidestep US restrictions - Latest News

    Chinese tech giant Huawei said on May 25 it had developed a new way of making semiconductors that could get around its U.S.-enforced lack of access to the most advanced chipmaking…

  9. lunedì 25 maggio 2026·rappler.com

    China's Huawei reveals chip design breakthrough amid US sanctions

    Huawei did not provide independent performance data, but the target is significant because 1.4 nanometers is expected to be close to the global frontier for advanced chipmaking…

  10. lunedì 25 maggio 2026·dailysabah.com

    Huawei unveils chip design breakthrough amid US sanctions

    Huawei Technologies announced on Monday that it expects to produce industry-leading semiconductors within five years using new technology, highlighting...

  11. lunedì 25 maggio 2026·thehindubusinessline.com

    Huawei unveils new approach to strengthen dominance in high-end chips

    Huawei claims the new advanced chips that it has planned to make are based on the Tau Scaling Law that could achieve transistor density levels equivalent to 1.4 nm.

  12. lunedì 25 maggio 2026·hindustantimes.com

    Huawei Says It Has Workaround to Match Leading Chips

    The Chinese tech juggernaut says it can match cutting-edge Intel semiconductors by 2031. | Business News

  13. lunedì 25 maggio 2026·fortune.com

    Huawei touts chip breakthrough to shorten gap with TSMC | Fortune

    Huawei will start making 1.4-nanometer chips by 2031 with its own “LogicFolding” technology, Huawei’s semiconductor chief He Tingbo said Monday.

  14. lunedì 25 maggio 2026·tomshardware.com

    Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new…

    Flagship Huawei Mate 90 series will be the first commercial processors to feature the LogicFolding architecture

  15. lunedì 25 maggio 2026·businessday.co.za

    China’s Huawei makes progress towards advanced chip production

    Company is upbeat on being competitive in 10 years for mobile and AI computing

  16. lunedì 25 maggio 2026·nbcnews.com

    China’s Huawei touts chip design breakthrough in bid to defy U.S. sanctions

    The tech giant said Monday that it had achieved a breakthrough that would allow it to make cutting-edge chips within five years.

  17. lunedì 25 maggio 2026·economictimes.indiatimes.com

    Huawei touts new chipmaking technology to sidestep US restrictions - The Economic Times

    Chinese tech giant Huawei said on Monday it had developed a new way of making semiconductors that could get around its US-enforced lack of access to the most advanced chipmaking…

  18. lunedì 25 maggio 2026·zerohedge.com

    Huawei Touts Sanctions-Busting Chip Breakthrough, SMIC Shares Erupt

    "In her speech, she presented the Tau (τ) Scaling Law, a new principle for guiding the future development of the semiconductor industry."

  19. lunedì 25 maggio 2026·benzinga.com

    Huawei Says It Has A Chipmaking Breakthrough. Did US Sanctions Backfire? - NVIDIA (NASDAQ:NVDA), Taiwan S

    Huawei says it has a chipmaking breakthrough that could narrow the gap with TSMC, raising fresh questions about whether U.S. semiconductor sanctions accelerated China's push for…

  20. martedì 26 maggio 2026·siliconangle.com

    China's Huawei unveils new sanctions-busting chip architecture that replaces Moore's Law - SiliconANGLE

    China's Huawei unveils new sanctions-busting chip architecture that replaces Moore's Law - SiliconANGLE