At the 2026 International Symposium on Circuits and Systems (ISCAS 2026) in Shanghai on Monday, He Tingbo, Huawei’s board member and head of its semiconductor business, said the company would launch a new Kirin smartphone chip this autumn that uses logic folding technology for the first time. The technology moves beyond conventional single-layer chip layouts by stacking logic structures into a dual-layer design, which can improve transistor density and energy efficiency, according to Huawei. The chip is expected to debut in Huawei’s Mate 90 smartphone series in September and compete with Apple’s iPhone 18 series. [TechNode reporting]