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Storia in 11 fonti

Huawei annonce avoir développé un nouveau mode de fabrication de puces

Ce procédé lui permet de s’affranchir des sanctions américaines concernant l’accès aux équipements de pointe.

Raccontata darfi.frthehindu.comhurriyetdailynews.comdailysabah.commanager-magazin.devalor.globo.comlecho.benbcnews.comledevoir.comeconomictimes.indiatimes.commilenio.com

Confronto fonti

6 prospettive sulla stessa storia
AI · summaries
ledevoir.comStai leggendo7 h fa

Huawei annonce avoir développé un nouveau mode de fabrication de puces

Ce procédé lui permet de s’affranchir des sanctions américaines concernant l’accès aux équipements de pointe.

originale
lecho.be8 h fa

Huawei annonce une avancée majeure dans la fabrication de puces ... qui inquiète les États-Unis

Huawei a annoncé lundi avoir développé une nouvelle approche d'ingénierie pour fabriquer ses semi-conducteurs de pointe. Une avancée qui lui permettrait de tirer son épingle du jeu, alors que la Chine est toujours…

Leggi questa versione → originale
rfi.fr16 h fa

Huawei touts new chipmaking technology to sidestep US restrictions

Chinese tech giant Huawei said on Monday it had developed a new way of making semiconductors that could get around its US-enforced lack of access to the most advanced chipmaking equipment.

Leggi questa versione → originale
economictimes.indiatimes.com7 h fa

Huawei touts new chipmaking technology to sidestep US restrictions - The Economic Times

Chinese tech giant Huawei said on Monday it had developed a new way of making semiconductors that could get around its US-enforced lack of access to the most advanced chipmaking equipment. Huawei has been at the centre…

Leggi questa versione → originale
thehindu.com15 h fa

Huawei touts new chipmaking technology to sidestep U.S. restrictions

Huawei said it had developed a new way of making semiconductors that could get around its U.S.-enforced lack of access

Leggi questa versione → originale
hurriyetdailynews.com15 h fa

Huawei touts new chipmaking technology to sidestep US restrictions - Latest News

Chinese tech giant Huawei said on May 25 it had developed a new way of making semiconductors that could get around its U.S.-enforced lack of access to the most advanced chipmaking equipment.

Leggi questa versione → originale

Timeline cronologica

  1. lunedì 25 maggio 2026·rfi.fr

    Huawei touts new chipmaking technology to sidestep US restrictions

    Chinese tech giant Huawei said on Monday it had developed a new way of making semiconductors that could get around its US-enforced lack of access to the most advanced chipmaking…

  2. lunedì 25 maggio 2026·thehindu.com

    Huawei touts new chipmaking technology to sidestep U.S. restrictions

    Huawei said it had developed a new way of making semiconductors that could get around its U.S.-enforced lack of access

  3. lunedì 25 maggio 2026·hurriyetdailynews.com

    Huawei touts new chipmaking technology to sidestep US restrictions - Latest News

    Chinese tech giant Huawei said on May 25 it had developed a new way of making semiconductors that could get around its U.S.-enforced lack of access to the most advanced chipmaking…

  4. lunedì 25 maggio 2026·dailysabah.com

    Huawei unveils chip design breakthrough amid US sanctions

    Huawei Technologies announced on Monday that it expects to produce industry-leading semiconductors within five years using new technology, highlighting...

  5. lunedì 25 maggio 2026·manager-magazin.de

    Trotz US-Sanktionen: Chinas Huawei kündigt Durchbruch bei Chipentwicklung an

    Die USA tun alles, um Chinas Techindustrie auf Abstand zu halten, doch Huawei gibt sich optimistisch: Auf einer Konferenz in Shanghai kündigte das Unternehmen einen Durchbruch in…

  6. lunedì 25 maggio 2026·valor.globo.com

    Novo chip Kirin para celulares supera restrições dos EUA, diz Huawei

    Antes dos controles de exportação dos EUA, a empresa chegou a ser a segunda maior fabricante de smartphones do mundo, superando a Apple

  7. lunedì 25 maggio 2026·lecho.be

    Huawei annonce une avancée majeure dans la fabrication de puces ... qui inquiète les États-Unis

    Huawei a annoncé lundi avoir développé une nouvelle approche d'ingénierie pour fabriquer ses semi-conducteurs de pointe. Une avancée qui lui permettrait de tirer son épingle du…

  8. lunedì 25 maggio 2026·nbcnews.com

    China’s Huawei touts chip design breakthrough in bid to defy U.S. sanctions

    The tech giant said Monday that it had achieved a breakthrough that would allow it to make cutting-edge chips within five years.

  9. lunedì 25 maggio 2026·ledevoir.com

    Huawei annonce avoir développé un nouveau mode de fabrication de puces

    Ce procédé lui permet de s’affranchir des sanctions américaines concernant l’accès aux équipements de pointe.

  10. lunedì 25 maggio 2026·economictimes.indiatimes.com

    Huawei touts new chipmaking technology to sidestep US restrictions - The Economic Times

    Chinese tech giant Huawei said on Monday it had developed a new way of making semiconductors that could get around its US-enforced lack of access to the most advanced chipmaking…

  11. lunedì 25 maggio 2026·milenio.com

    Huawei anuncia avance en el diseño de chips pese a sanciones de EU

    Pone de relieve esfuerzos de Pekín por contrarrestar las sanciones estadunidenses que han dificultado a China la fabricación de chips avanzados.