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ASML locks in TSMC, Samsung, and Intel while Huawei races to break its grip
ASML has won over Samsung, TSMC, and Intel to switch to larger photomasks, which should boost the throughput of its newest EUV machines by 40 percent. Meanwhile, Huawei is orchestrating China's counter-strategy, aiming to break its dependence on the Dutch lithography technology through equipment maker Yuliangsheng and its own suppliers.
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nrc.nl
ASML gaat samenwerken met Taiwanese chipgigant TSMC om zijn nieuwste chipmachines te upgraden
Chiptechnologie: Chipmachinemaker ASML smeedt een coalitie van chipfabrikanten om zijn meest geavanceerde High-NA EUV-machine te upgraden, samen met chipgigant TSMC. Het doel:…
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tomshardware.com
Intel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combined — company also trailblazing giant 6×12…
