The Xring 03 is, a little confusingly, the follow-up to last year’s Xring 01, which appeared in the China-only 15S Pro phone and Pad 7 Ultra tablet. The 3nm chipset, apparently produced by TSMC, has the usual CPU and GPU bumps, plus mobile-first support for LPDDR6 RAM. [Image: Xiaomi will have to manufacture the Xring 03 at serious scale if it wants true independence from Qualcomm. https://platform.theverge.com/wp-content/uploads/sites/2/2026/08/xiaomi-xring-03.jpg?quality=90&strip=all]

BEIJING, Aug 24 : Chinese smartphone maker Xiaomi on Monday unveiled a new version of its in-house Xring smartphone processor, betting that deeper control over key components will…

Xiaomi unveiled its Xring O3 processor built on TSMC's 3nm technology, targeting 200,000 to 300,000 initial units in a flagship foldable

Second in-house processor strengthens the smartphone maker’s push into foldables