Company says 3D design can deliver world-beating chips without the best chipmaking gear, rewriting the playbook for China’s tech future.

Huawei's Tau Scaling Law and LogicFolding 3D architecture aim to bypass US sanctions by rethinking chip design, targeting 1.4nm-equivalent density by 2031.

Presentation in Shanghai shows how company is trying to shift conversation from what it cannot buy to what it can still build.

The Chinese company is adapting to the demise of Moore’s Law, which guides chip production. It could complicate US chip dominance.

While China's semiconductor industry navigates intensified trade hurdles and narrows the gap with global competitors, a newly proposed industry theory from Huawei Technologies Co…

Huawei unveiled Tau Scaling Law and LogicFolding technology to match TSMC's 1.4nm chip density by 2031 without EUV lithography machines blocked by US sanctions.

China has been barred since 2019 from importing ASML's most advanced extreme ultraviolet (EUV) lithography machines, curbing the ability of its chipmakers to keep up with global…

China's electronics giant Huawei is pioneering a new chip design approach. This method focuses on reducing signal transmission time instead of shrinking transistors. The company…

Company says 3D design can deliver world-beating chips without the best chipmaking gear, rewriting the playbook for China’s tech future.