Tau Law aims to reduce latency and raise energy efficiency through LogicFolding and optical interconnects. The question is whether engineering gains can offset China’s process-node gap
Huawei targets 1.4-nanometer equivalent chip density by 2031 via proprietary 3D architecture, bypassing U.S. lithography restrictions. This demonstrates China's capacity for advanced semiconductor development independently, threatening Western foundries' process node advantage.
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He Tingbo announced at the conference that by 2031, the transistor density of Huawei's high-end chips based on the Tau (τ) law is expected to reach the equivalent of a 1.4-nanometer process. Photo: VCG
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