China's electronics giant Huawei is pioneering a new chip design approach. This method focuses on reducing signal transmission time instead of shrinking transistors. The company aims to boost performance and energy efficiency. This innovation could help Huawei bypass US sanctions. High-end chips are expected by 2031. This marks a significant shift in chip development.

The Chinese tech giant says its new stacked-chip architecture can deliver transistor density equivalent to 1.4nm processes by 2031, without access to advanced lithography tools

If proven, the innovation marks a significant milestone for Huawei, which has been cut off from advanced semiconductor technology since 2019.