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AI Gold Rush: Two of the world's "big three" memory manufacturers began collaborating on a new memory standard for accelerating AI workloads in 2025. Now, the first technical specification for High Bandwidth Flash memory is ready for major data center manufacturers to experiment with.
A year ago, SanDisk and SK Hynix announced a collaboration to develop a common standard for the High Bandwidth Flash (HBF) project. The new type of memory is designed to improve performance and power efficiency in AI data centers and can now be implemented in new data center projects thanks to the newly announced HBF technical specification.
The first HBF technical specification is part of the Open Compute Project, which means it should be freely available for adoption in custom data center projects or server designs. SanDisk and SK Hynix are the main contributors to the new specification, but other major AI industry players including Google and Tenstorrent have joined the standardization process with their own ideas and technology validation procedures.
