Samsung Electronics has crossed the $1 billion sales mark for its next-generation AI memory chips, a milestone that took roughly four months from the start of mass production. The company’s high-bandwidth memory (HBM) 4 chips, which began shipping on February 12, 2026, claim performance improvements exceeding 40% over previous standards.
The HBM4 rollout and the AMD deal
Mass production kicked off in February, and by March 18, the company had locked down a memorandum of understanding with AMD to supply HBM4 chips for the Instinct MI455X GPU and EPYC processors.
The partnership targets bandwidths of up to 3.3TB/s, achieved through a 10nm-class manufacturing process.
Samsung and NVIDIA held discussions at the GTC 2026 event focused on HBM4E integration and future HBM5 architecture.
