FANOUT ADVANTAGE:
The chairman spoke confidently about the advantage from its packaging method, as the company looks forward to an investment with Broadcom
By Lisa Wang
/ Staff Reporter
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Powertech says it is on track to ship for AMD soon - Taipei Times
Powertech Technology Inc (力成科技), which provides packaging services for memory and logic chips, yesterday said that it is on track to start shipping artificial intelligence (AI) chips utilizing its advanced panel-level packaging (PLP) technology for Advanced Micro Devices Inc (AMD) in the second half
TL;DRAI
Powertech ships AI chips for AMD via fanout PLP in H2 2026: 45 per package vs 8-9 wafer—cost breakthrough. $400M Broadcom partnership: packaging density is now critical AI datacenter advantage—controls capex efficiency and time-to-market.
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