FANOUT ADVANTAGE:
The chairman spoke confidently about the advantage from its packaging method, as the company looks forward to an investment with Broadcom
By Lisa Wang
/ Staff Reporter
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Powertech says it is on track to ship for AMD soon - Taipei Times
Powertech Technology Inc (力成科技), which provides packaging services for memory and logic chips, yesterday said that it is on track to start shipping artificial intelligence (AI) chips utilizing its advanced panel-level packaging (PLP) technology for Advanced Micro Devices Inc (AMD) in the second half
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