Powertech to invest in venture with Broadcom - Taipei Times

SINGAPORE PLANS:

The joint venture would focus on offering technology for advanced package substrates in response to demand from an international customer

By Lisa Wang / Staff reporter

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Powertech Technology Inc (力成科技), a provider of memory and logic chip packaging services, on Thursday said it plans to invest US$400 million to create a new joint venture with Broadcom Inc in Singapore to cater to customer demand for advanced panel-based packaging services.The joint venture would concentrate on offering additive finer-geometry redistribution layer (RDL) technology for advanced package substrates, Powertech said in a statement after the company’s board of directors approved the deal.RDL is a crucial part of fan-out panel-level packaging (FOPLP) technology, which relies on RDL to route electrical connections beyond the physical footprint of silicon.