Samsung Electronics and Broadcom have sealed a chip production collaboration that could be worth $200 billion over five years.
The partners have signed a memorandum of understanding covering joint projects on memory, chip foundry, and advanced packaging technologies.
– Samsung Electronics
Across memory, Samsung and Broadcom plan to “pursue a strategic collaboration for the supply of industry-leading memory solutions,” including high-bandwidth memory, which will support Broadcom’s next-generation AI accelerators.
Meanwhile, across foundry and packaging, the partners’ collaborative efforts will focus on bringing Samsung’s sub-2nm process node technologies to Broadcom’s products, and extending advanced packaging solutions built on the 2nm process, including 2.3D and 2.5D integrations. This will enable higher-performance and more power-efficient AI and networking silicon, Samsung said.
