Samsung Electronics Co.
Ltd.
(OTC:SSNLF) said Saturday it signed a memorandum of understanding with Broadcom (NASDAQ:AVGO) to expand cooperation in memory chips, contract manufacturing and advanced packaging, a partnership projected to exceed $200 billion through 2030.
Custom AI Chips Drive Deal The five-year agreement combines Broadcom’s expertise in designing application-specific integrated circuits with Samsung’s chip manufacturing capabilities.
Under the deal, Broadcom’s next-generation communication chips will be produced using Samsung’s sub-2-nanometer process technology, according to Samsung.
