Samsung Electronics just locked down one of the largest semiconductor partnerships in recent memory. The South Korean chipmaker signed a memorandum of understanding with Broadcom valued at over $200 billion, covering advanced memory chips and cutting-edge foundry manufacturing for AI semiconductors.
The deal, signed on July 24 at an AI Summit in San Francisco, represents one of Samsung’s biggest commitments to a single customer.
What the deal actually covers
The MOU spans several layers of the semiconductor stack. On the memory side, Samsung will supply Broadcom with advanced high-bandwidth memory chips, specifically HBM4 and HBM4E, the next-generation memory products that AI accelerators desperately need to function.
On the foundry side, Samsung will manufacture Broadcom’s AI chips using 2-nanometer and below processes at its manufacturing campus in Pyeongtaek, South Korea. The agreement also includes advanced packaging support, integrating memory, logic, and packaging into a unified solution for AI workloads.
