AMD to promote packaging ecosystem - Taipei Times

DEMAND IS REAL:

AMD’s CEO brushed off skepticism about the AI boom and said there are a lot of innovations and opportunities for companies in the AI ecosystem

By Lisa Wang

/ Staff Reporter

Advanced Micro Devices Inc (AMD) yesterday said it is investing US$10 billion in the Taiwanese microchip ecosystem to ensure the availability of advanced packaging technology capacity over the next three years, given rapidly growing artificial intelligence (AI) infrastructure demand.In addition to advanced chips, the new investment also aims to foster a new advanced packaging ecosystem in Taiwan using elevated fan-out bridge (EFB) technology, the chip company said.“So what we are doing with a number of our partners is to really coinvest so that the capacity is available for revenue later in 2026, but also into 2027, 2028 and 2029,” AMD CEO Lisa Su (蘇姿丰) told a news briefing arranged by CommonWealth Magazine in Taipei yesterday.

AMD to promote packaging ecosystem - Taipei Times

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