Lisa Su’s Taiwan announcement covers advanced silicon, packaging and manufacturing partnerships for the company’s rack-scale Helios platform, set for deployment in the second half of 2026.
AMD announced on Wednesday more than $10bn of investments across Taiwan’s semiconductor ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure.
The commitment covers a multi-year deployment of silicon, packaging and supply-chain capacity built around the company’s rack-scale Helios platform, scheduled for second-half 2026 customer deployment.
On named partners, the announcement covers work with ASE and SPIL on next-generation wafer-based 2.5D bridge interconnect technology, alongside other Taiwan-based suppliers AMD has not separately listed in the public release.
The technology track filed in the company’s 8-K materials is calibrated to support the Helios platform’s full-rack scale architecture, where AMD has been positioning against Nvidia’s GB200 and GB300 NVL72 systems through the past three quarters.
