AMD has announced more than $10bn of investments across Taiwan's AI semiconductor ecosystem, with ASE and SPIL named as packaging partners and the rack-scale Helios platform set for H2 2026 customer deployment.

AMD commits over $10 billion to Taiwan for AI partnerships and advanced packaging capacity, intensifying competition with Nvidia in the global AI chip race.

AMD has announced more than $10bn of investments across Taiwan's AI semiconductor ecosystem, with ASE and SPIL named as packaging partners and the rack-scale Helios platform set…