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Powertech says it is on track to ship for AMD soon - Taipei Times

Powertech Technology Inc (力成科技), which provides packaging services for memory and logic chips, yesterday said that it is on track to start shipping artificial intelligence (AI) chips utilizing its advanced panel-level packaging (PLP) technology for Advanced Micro Devices Inc (AMD) in the second half

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Powertech says it is on track to ship for AMD soon - Taipei Times

Powertech ships AI chips for AMD via fanout PLP in H2 2026: 45 per package vs 8-9 wafer—cost breakthrough. $400M Broadcom partnership: packaging density is now critical AI datacenter advantage—controls capex efficiency and time-to-market.

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theinformation.com1 mese fa

TSMC Develops AI Chip Packaging Tech to Counter Intel

Taiwan Semiconductor Manufacturing Co. is developing an advanced chip-packaging technology similar to what Intel already offers, according to two people with direct knowledge of the project, a sign that the world’s…

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martedì 28 luglio 2026·taipeitimes.com
Powertech says it is on track to ship for AMD soon - Taipei Times
Powertech Technology Inc (力成科技), which provides packaging services for memory and logic chips, yesterday said that it is on track to start shipping artificial intelligence (AI)…
giovedì 30 luglio 2026·theinformation.com
TSMC Develops AI Chip Packaging Tech to Counter Intel
Taiwan Semiconductor Manufacturing Co. is developing an advanced chip-packaging technology similar to what Intel already offers, according to two people with direct knowledge of…