Taiwan Semiconductor Manufacturing Co.
(NYSE:TSM) is reportedly developing an advanced packaging technology, which could erode Intel Corp.'s (NASDAQ:INTEL) competitive advantage.
Intel's stock is trading 4.62% higher in Friday's pre-market trading session, while TSMC stock is trading 3.69% higher.
TSMC is reportedly developing a chip packaging technology similar to Intel's Embedded Multi-die Interconnect Bridge (EMIB), internally called "EMIB Like," and is partnering with Taiwan's Kinsus Interconnect Technology on the project, according to The Information on Thursday.
The report also said Nvidia Corp.
