ASMPT Group CEO Robin Ng laid this out plainly in a Bloomberg interview on July 29, saying chip architecture will continue to evolve as newer AI systems use more chips. For a company that specializes in semiconductor assembly and packaging, that’s less of a prediction and more of a business forecast.
The packaging play nobody’s talking about enough
Most AI hardware conversations fixate on chip designers like Nvidia or AMD. The companies that physically put those chips together get far less attention. ASMPT, headquartered in Singapore, is one of the largest players in back-end semiconductor packaging, the stage where individual chips get assembled into the multi-chip modules that power data centers.
The company’s key product in this AI boom is its thermo-compression bonding tools, known as TCB tools. These machines are essential for connecting chips in the tight, precise configurations that AI and high-performance computing applications require.
In December 2025, ASMPT secured orders for 19 chip-to-substrate TCB tools specifically built for AI and HPC applications.
