Xiaomi has unveiled its new Xring O3 processor, manufactured by TSMC, to reduce reliance on external chip suppliers. This advanced chip will debut in an upcoming flagship foldable smartphone, with initial shipments projected. The company is also developing specialized chips for AI and autonomous driving applications. Xiaomi has invested significantly in chip design, expanding its semiconductor workforce to over 3,000 employees.

BEIJING, Aug 24 : Chinese smartphone maker Xiaomi on Monday unveiled a new version of its in-house Xring smartphone processor, betting that deeper control over key components will…

Xiaomi unveiled its Xring O3 processor built on TSMC's 3nm technology, targeting 200,000 to 300,000 initial units in a flagship foldable

Second in-house processor strengthens the smartphone maker’s push into foldables