Empresa afirmou que os chips HBM4E de 12 camadas representam melhoria de mais de 20% na velocidade de processamento de dados e um aumento de mais de 30% na capacidade em relação à geração anterior

SEOUL, May 29 : Samsung Electronics said on Friday it has started shipping samples of its latest high-bandwidth memory (HBM) chip, or the 12-layer HBM4E, marking what it said was…

Samsung Electronics said Friday it has begun shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the world's first ship