Samples of Samsung Electronics' next-generation 12-layer high bandwidth memory, HBM4E [SAMSUNG ELECTRONICS]
Samsung Electronics has begun shipping samples of its next-generation 12-layer high bandwidth memory (HBM), HBM4E, to customers.
Following sample supply and optimization, the chipmaker plans to begin mass production based on customer demands.
The sample shipments began earlier than Samsung initially forecast, as it originally expected delivery to take place in the middle of this year. The accelerated timeline reflects the company's push to stay ahead in the increasingly competitive AI memory market.
“Following the successful mass production of HBM4, Samsung has once again demonstrated its distinct technological edge with HBM4E,” said Hwang Sang-joon, the executive vice president and head of memory development at Samsung Electronics. “Through our advanced manufacturing capabilities and pre-emptive infrastructure investments, we will continue to drive the growth of the global AI memory market.”
