An exterior view of the Samsung Electronics headquarters in Seoul, South Korea. File. Photo by YONHAP / EPA
May 29 (Asia Today) -- Samsung Electronics said Friday it shipped samples of its seventh-generation high-bandwidth memory chip, HBM4E, for the first time, demonstrating its competitiveness in advanced semiconductor technology.
The shipment came three months after Samsung began mass shipments of HBM4 in February, raising expectations that the company could expand its share of the HBM market.
Samsung said it supplied 12-layer HBM4E samples to global customers. The company did not identify the customers, but industry officials said the samples were likely supplied to Nvidia, a major buyer of AI chips.
Samsung said the HBM4E shipment goes beyond an expansion of its product lineup and could strengthen the company's supply capacity and technological edge in the global AI infrastructure market, which is expected to grow rapidly for years.
