SK Hynix said it plans to start volume production of next-generation HBM4E chips at its Indiana facility in the third quarter of 2029. The West Lafayette site is expected to house a packaging line and an AI semiconductor research and development facility, and cleanroom operations are scheduled for the second half of 2028. The more than $4 billion project is meant to bring production closer to major customers and strengthen the company’s U.S. supply chain. SK Hynix said the site could eventually reach annual capacity of hundreds of thousands of wafers and create about 7,000 direct and indirect jobs locally.
Semiconductor and memory chip company SK Hynix CEO Kwak Noh-Jung attends the company's opening bell ceremony at the Nasdaq market on the day of their IPO in New York City, Jul. 10. Reuters-Yonhap
WEST LAFAYETTE, Indiana — South Korean chipmaker SK Hynix said on Thursday it plans to begin volume production of its next-generation HBM4E chips at its Indiana facility in the third quarter of 2029, and expects the site to eventually reach annual capacity of hundreds of thousands of wafers.
The more than $4 billion project marks a major expansion of SK Hynix's U.S. operations as surging investment in artificial intelligence drives demand for high-bandwidth memory, or HBM. The chipmaker seeks to bring production closer to major customers including Nvidia, Microsoft and Alphabet's Google.
