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The South Korean chipmaker plans to begin mass production of next-generation HBM chips at the West Lafayette facility in the third quarter of 2029
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SK Hynix held a groundbreaking ceremony on Thursday for an advanced chip packaging facility in West Lafayette, Indiana, marking the South Korean chipmaker's first high-bandwidth memory production base in the United States.
The facility, located at Purdue Research Park, represents a total investment of more than $4 billion. SK Hynix plans to open the cleanroom by October 2028 and begin volume production of its next-generation HBM4E chips in the third quarter of 2029, according to Reuters. The company said the plant is designed to support a workforce of around 1,000 people when it reaches full capacity, while the overall investment is projected to sustain roughly 7,000 jobs in total when construction, ongoing operations, and supplier activity are counted together.
