Artificial intelligenceSouth Korean giant to assemble next-gen HBM4E memory for American customers onshoreSouth Korea's SK Hynix's more than $4 billion construction project includes an advanced chip packaging facility as well as a research and development complex in West Lafayette, Indiana, which is home to Purdue University. (Photo by Yifan Yu)YIFAN YUAugust 28, 2026 00:31 JSTWEST LAFAYETTE, Indiana -- South Korean chipmaker SK Hynix officially broke ground on Thursday on what will be its first U.S. plant for producing high-bandwidth memory (HBM) chips, a key component that underpins the artificial intelligence infrastructure buildout.