South Korean chipmaker SK Hynix (NASDAQ:SKHY) said Thursday it will begin volume production of next-generation HBM4E chips at its Indiana facility in the third quarter of 2029, as CEO Kwak Noh-Jung warned the current memory shortage will persist through 2030.
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The more than $4 billion project will expand SK Hynix’s presence in the United States as growing AI investment drives demand for high-bandwidth memory.
The site at Purdue Research Park will allow the company to produce chips closer to major customers such as Nvidia (NASDAQ:NVDA), Microsoft (NASDAQ:MSFT), and Alphabet (NASDAQ:GOOG) (NASDAQ:GOOGL).
Jung said, “The United States is the epicenter of AI innovation, bringing together premier customers, top-tier R&D capabilities, and partners, and the Indiana fab will become a gateway to deliver first Made in USA HBM products.”










