Samsung Electronics has announced a next-generation version of its tenth-generation vertically stacked NAND memory, known as V-NAND, as it expands its relationship with AI chipmaker Nvidia.
The world’s biggest memory chip manufacturer announced the technology, called V10 Bonding V-NAND or BV-NAND, at the Future of Memory and Storage (FMS) in Santa Clara.
The chip features more than 400 vertical layers of memory and a new wafer-bonding architecture to increase density and improve performance, Samsung said.
Samsung Electronics’ ninth-generation (V9) V-NAND memory product. Image credit: Samsung
High-capacity memory
