Insider Brief
Researchers from Ghent University and imec highlighted micro-transfer printing as a method for integrating different material systems into silicon photonics platforms.
The study shows that micro-transfer printing can enable heterogeneous integration of materials such as III-V semiconductors and lithium niobate with CMOS-compatible photonic technologies.
The approach could support future photonic systems for applications including AI infrastructure, communications, quantum technologies, and advanced computing.
Press release – Silicon photonics has emerged as a promising technology for addressing bandwidth and latency bottlenecks of conventional electrical interconnects and therefore are being explored for future artificial intelligence infrastructure. However, heterogenous integration of multiple material systems remains a challenge. Now, researchers show how micro-transfer printing can enable highly versatile heterogenous integration to expand the functionality of silicon photonics, paving the way for advanced photonic systems.
