Song Jai-hyuk, president and chief technology officer at Samsung’s Device Solutions Division, introduces a mock-up of the firm's high-bandwidth memory 5 chip during the COMPUTEX 2026 exhibition in Taiwan, Tuesday. Courtesy of Samsung ElectronicsSamsung Electronics unveiled a mock-up of its next-generation high-bandwidth memory 5 (HBM5) chip for the first time at COMPUTEX 2026 in Taiwan, Tuesday.Song Jai-hyuk, president and chief technology officer at Samsung’s Device Solutions Division, displayed the firm’s strong willingness to lead the technological leadership in the next-generation HBM market by deepening partnerships with global firms.“We will continue to strengthen our technological competitiveness in the next-generation memory chips by teaming up with global firms, such as Nvidia,” Song said at the exhibition.He also underscored the importance of thermal management technology amid the booming artificial intelligence (AI) industry.As AI systems grow more powerful and densely integrated, thermal management and data processing efficiency are emerging as key competitive differentiators along with the performance of memory chips, according to Song.Central to Samsung’s HBM5 strategy is its proprietary Heat Path Block (HPB) technology. HPB helps lower thermal resistance and improve operational stability to address intensifying heat generated from ever-growing AI memory performance.Samsung Electronics said it has already implemented and validated the HPB architecture in its HBM4E products, confirming structural design, reliability and package stability in an integrated verification process.Samsung also showcased its HBM4E wafer and chipset at the exhibition. Samsung’s HBM4E delivers a stable pin speed of 14 gigabits per second and is capable of reaching up to 16 gigabits per second. Samsung completed its first sample shipment last week.Omdia, a global market research firm, projects the global HBM market to more than triple in value from approximately $58.9 billion (89 trillion won) in 2026 to around $198.3 billion by 2029.“We will rapidly respond to growing demand for HBM chips by preemptively developing relevant technologies and focus more on expanding our market share,” a company official said.