Samsung unveils HBM5 mock-up at Taiwan trade show - The Korea Times

Samsung reveals HBM5 mockup in bid to regain AI memory lead

Samsung unveiled HBM5 with Heat Path Block at Computex to challenge SK hynix in the $198B AI memory market by 2029. For IT teams, HBM5 thermal efficiency enables denser AI systems at lower power, driving infrastructure procurement and supplier strategy changes.