Intel and 3DGS Inc. are pouring $3.3 billion into a new substrate manufacturing plant in India’s Odisha state. The facility, located in the Bhubaneswar-Khurda region, will focus on advanced packaging technologies that are becoming increasingly critical to the global chip supply chain.
What’s actually being built
The plant will specialize in glass core substrates and high-density interconnect substrates. These are the layers that sit between a silicon chip and the circuit board it’s mounted on, routing electrical signals and managing heat. Glass core substrates offer better electrical performance and thermal stability than traditional organic alternatives.
The project is expected to take five to six years to complete. Once operational, it should create more than 1,800 direct high-skilled jobs in the region.
The announcement follows a groundbreaking ceremony on April 19, 2026, for India’s first advanced 3D glass semiconductor packaging facility. That earlier event was backed by the same Intel-3DGS partnership, suggesting a coordinated buildout rather than a one-off commitment.
