India’s semiconductor ambitions got a fresh boost on May 29 with the signing of a tripartite memorandum of understanding between the Odisha government, Intel Corporation and US-based 3D Glass Solutions Inc (3DGS) to establish an advanced packaging glass core substrate manufacturing facility in the state.The proposed project, to be located in the Bhubaneswar-Khurda region, entails an estimated investment of about $3.3 billion, making it among the country’s largest investments in high-technology manufacturing.The agreement was signed in the presence of Electronics and IT minister Ashwini Vaishnaw, Odisha Chief Minister Mohan Charan Majhi, Intel chief executive Lip-Bu Tan and senior industry executives.Officials said the facility would manufacture advanced packaging glass core substrates, high-density interconnect substrates and related semiconductor components, with Intel expected to provide technology expertise and process support.Vaishnaw said the agreement aligned with the Centre’s broader strategy of developing a complete semiconductor manufacturing ecosystem in the country. He said the participation of global technology firms reflected growing industry confidence in India’s semiconductor push under the India Semiconductor Mission.