Odisha, Intel, and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. This project, with an investment of $3.3 billion, will be located in the Bhubaneswar-Khurda region. The facility will produce advanced semiconductor components.

Ashwini Vaishnaw says latest pact will strengthen semiconductor ecosystem amid push for domestic chip production

Odisha, Intel, and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. This project, with an investment of $3.3…

Intel and 3D Glass Solutions have signed an MoU to build a $3.3bn advanced-packaging glass-substrate plant in Odisha, deepening India’s chip-manufacturing bet.

NEW DELHI, May 29 : U.S. chipmaker Intel and 3DGS Inc. USA will invest about $3.3 billion to set up a substrate manufacturing plant in the eastern Indian state of Odisha, the…

Intel, Odisha government and 3DGS signed an MoU for a USD 3.3 billion semiconductor substrate manufacturing project in India.

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A significant investment of $3.3 billion is set to boost India's semiconductor ecosystem. Intel, Odisha government, and 3D Glass Solutions have signed a memorandum of…

Intel and 3DGS are investing $3.3 billion in an advanced substrate manufacturing plant in Odisha, India, creating 1,800 jobs over a 5-6 year buildout.

New Delhi has pledged billions of dollars in subsidies to attract semiconductor plants and related manufacturing as a part of Prime Minister Narendra Modi's wider push to build…