Odisha, Intel, and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. This project, with an investment of $3.3 billion, will be located in the Bhubaneswar-Khurda region. The facility will produce advanced semiconductor components.

Ashwini Vaishnaw says latest pact will strengthen semiconductor ecosystem amid push for domestic chip production

Odisha, Intel, and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. This project, with an investment of $3.3…

Intel, Odisha government and 3DGS signed an MoU for a USD 3.3 billion semiconductor substrate manufacturing project in India.