The fight over who makes the world’s chips is increasingly a fight over the parts of a chip nobody photographs. India has just landed one of them.
Intel and 3D Glass Solutions have signed an agreement to build a roughly $3.3 billion substrate-manufacturing plant in the eastern state of Odisha, the government announced on Friday.
The memorandum of understanding, signed between the Odisha government, Intel Corporation and 3DGS Inc., covers an advanced-packaging glass-core substrate facility in the Bhubaneswar-Khurda region, to be built over five to six years.
India’s electronics and IT minister, Ashwini Vaishnaw, framed it as one of the largest high-technology manufacturing commitments the country has secured.
The 💜 of EU techThe latest rumblings from the EU tech scene, a story from our wise ol' founder Boris, and some questionable AI art. It's free, every week, in your inbox. Sign up now!Substrates are the unglamorous layer that makes modern chips work. They are the engineered base a processor is mounted on, routing power and signals between the silicon and the circuit board, and as chipmakers hit the limits of shrinking transistors, the packaging around the silicon has become where much of the performance gain now lives.
