Intel and 3DGS are investing $3.3 billion in an advanced substrate manufacturing plant in Odisha, India, creating 1,800 jobs over a 5-6 year buildout.

Ashwini Vaishnaw says latest pact will strengthen semiconductor ecosystem amid push for domestic chip production

Odisha, Intel, and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. This project, with an investment of $3.3…

Intel, Odisha government and 3DGS signed an MoU for a USD 3.3 billion semiconductor substrate manufacturing project in India.