When the US government put Huawei on its Entity List back in 2019, the implicit bet was that cutting off access to advanced chip technology would slow the company down. Seven years later, Huawei just unveiled a 122.88TB solid-state drive built with a packaging trick that sidesteps those very restrictions.
The company showcased the new enterprise SSDs during its ID Forum events from May 21 to May 23, 2026, alongside a 61.44TB model and confirmation that a 245TB variant is currently under development.
How Die-on-Board changes the math
The core innovation here is something Huawei calls Die-on-Board, or DoB, packaging. Traditional SSDs stack NAND flash memory dies into packages that are then soldered onto a printed circuit board. Huawei’s approach skips the middleman: it mounts the NAND dies directly onto the PCB itself.
The result is a 33% increase in capacity density compared to conventional packaging methods.
