Can ASML's Tie-Up With TSM to Advance High NA EUV Drive Growth?

ASML targets 2033 for High-NA EUV with larger masks, promising a 40% productivity gain

ASML targets 2033 for 12-inch High-NA EUV masks, enabling 40% productivity gains and supporting larger AI chip designs. This impacts chipmaker capex strategy: supporting larger dies drives High-NA EUV adoption across memory and logic, with volume production ramping 2028-2033.