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ASML and TSM are collaborating on a 12-inch photomask pilot line to advance High NA EUV and boost semiconductor manufacturing efficiency.
ASML $ASML Holding N.V. ASML is advancing next-generation semiconductor manufacturing through a collaboration with Taiwan Semiconductor Manufacturing Company Limited TSM to support the future development of High Numerical Aperture Extreme Ultraviolet (NA EUV) technology. The initiative aims to improve manufacturing efficiency and help the semiconductor industry fully use the capabilities of this advanced technology.The partnership plans to establish a 12-inch photomask pilot line by 2031, supporting the broader lithography ecosystem's readiness for advanced-node production by 2033. The transition from existing 6-inch masks to larger 12-inch masks is expected to enhance the value of ASML’s High NA EUV technology by improving fab productivity, lowering chipmaking costs and removing stitching constraints for increasingly complex semiconductor designs.ASML’s advanced semiconductor manufacturing systems are expected to play an important role as chip designs become more complex, particularly to support artificial intelligence (AI) applications. High-NA EUV adopters and other major suppliers have expressed interest in joining the initiative, supporting the development of a broader ecosystem around the platform.The transition to larger-format photomasks could extend the technological and economic advantages of ASML’s lithography tools and reinforce the company’s role in developing technologies for future high-performance computing and AI processors.
